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And a method of manufacturing the depletion mode FET and monolithic integrated enhancement mode

机译:以及一种耗尽型FET和单片集成增强模式的制造方法

摘要

I provide a monolithic integrated enhancement mode / depletion mode FET devices that uniformity of quality and enhanced stability to reduce the [challenge] manufacturing cost. I an integrated circuit monolithically with (E mode) FET enhancement mode (D mode) FET depletion mode in the semiconductor multilayer structure of the resolution means a single. Providing a channel layer in the multilayer structure, it overlays the barrier layer on top of it that overlay the ohmic contact layer thereon. I connected to the ohmic contact layer the drain contact and source contacts of the E-mode FET and D-mode FET these. I also connected to the barrier layer of the gate contact E-mode FET and D-mode FET. I provide an amorphous area under the E-mode gate contact in the barrier layer. This amorphous region is configure the embedded E-mode Schottky contact between the barrier layer. Is connected to the first layer which is overlaid on the barrier layer and the gate contact of the D-mode FET in the embodiment, instead, to form a D-mode amorphized regions in the layer of the first. [Selection Figure 6
机译:我提供了一种单片集成增强模式/耗尽模式FET器件,该器件具有质量均匀性和增强的稳定性,从而降低了制造成本。图1所示的集成电路具有单片式(E模式)的FET增强模式(D模式)的FET耗尽模式在半导体多层结构中的分辨率单一。在多层结构中提供沟道层,它覆盖在其顶部的阻挡层,该阻挡层覆盖其上的欧姆接触层。我将E模式FET和D模式FET的漏极触点和源极触点连接到欧姆接触层。我还连接到栅极接触的E型FET和D型FET的势垒层。我在势垒层中的E模式栅极接触下提供了一个非晶区域。该非晶区配置为势垒层之间的嵌入式E型肖特基接触。在该实施例中,连接到覆盖在阻挡层和D模式FET的栅极触点上的第一层,以在第一层中形成D模式非晶化区域。 [选择图6

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