Batching with the heat and pressure arrival device where multi-stage joint structure

摘要

PROBLEM TO BE SOLVED: To enable high-density mounting of electronic components, which are excellent in reliability, by a method wherein a plurality of circuit boards, which are respectively mounted with each electronic component, are connected with each other in a multistage with bonding agents via spacer members with connection terminals, which are alternately arranged on each stage. ;SOLUTION: Circuit boards 1, which are respectively placed previously with a bonding agent 4, are arranged in a multistage via spacer members 2 and heaters 3 having roughly the same thickness as that of these spacer members 2. At this time, the members 2 and the heaters 3 are arranged in such a way that they are alternately provided on each stage. The circuit boards 1 between upper and lower heating heads 5 and 6 are heated and pressed, at the same time, the heaters 3 are operated to soften and cure the bonding agents 4, and the boards 1 and the members 2 are bonded together in a multistage en bloc. As a result, stresses to generate in the connection parts of the boards 1 with each other are scattered, the highly reliable connection of the boards 1 is obtained and at the same time, it becomes possible to arrange a plurality of the boards 1 in a three-dimensional manner, and a high-density mounting of electronic components is facilitated.;COPYRIGHT: (C)1999,JPO