Heat and pressure arrival device and heat and pressure arrival manner

摘要

PPROBLEM TO BE SOLVED: To provide a hot press bonding equipment which controls a variation of a press load in melting of a solder bump, and to provide its hot press bonding method. PSOLUTION: The time when the solder bump 10a starts to melt is detected by a displacement of a head 7 in the pressing direction, the pressing load w is constantly kept by performing load control using a load cell 4 till the solder starts to melt, and after the solder bump 10a starts to melt, the height of mounting is constantly kept by making position control using a linear scale 5. Thereby, the variation of the press load in melting of the solder bump 10a is controlled, and the state that an excess load acts on an electronic component 10 and substrate 11 can be prevented. Moreover, the height of mounting reduced in melting of the solder bump 10a is corrected by the position control using the linear scale 5, thereby, the optimum height of mounting for design can be retained, and the quality of mounting can be held. PCOPYRIGHT: (C)2008,JPO&INPIT