The heat and pressure arrival device and heat and pressure arrival manner null

摘要

PROBLEM TO BE SOLVED: To provide a system and a method for thermocompression bonding of an electronic component in which warp on the lower surface of a compression tool is corrected efficiently with high accuracy and compression bonding quality can be ensured.;SOLUTION: At the time of heating a compression bonding tool 21 for thermocompression bonding of an electronic component to a substrate, heat blocks 14A and 14B are arranged vertically in two stages on side face parallel to the longitudinal direction of the tool 21 and a heat block 15 is arranged on the opposite side face. Temperature of the heat block 14A proximate to the lower end of the compression bonding tool 21 is controlled to a set level associated with the compression boding temperature of the compression bonding tool 21, the heat block 14B is controlled at a temperature for correcting vertical warp of the compression bonding tool 21 and the heat block 15 on the opposite side is controlled at a temperature for correcting horizontal warp of the compression bonding tool 21.;COPYRIGHT: (C)2002,JPO