Method and structure for improving bonding reliability in bond pads

摘要

A method for fabricating a bond pad structure in an integrated circuit is provided. In one embodiment, a bond pad is formed above a substrate. A first passivation layer is deposited above the bond pad, the first passivation having an opening therein exposing a portion of the bond pad. A conductive layer is deposited over the first passivation layer and the exposed bond pad. The conductive layer is patterned to expose portions of the first passivation layer. A second passivation layer is deposited above the conductive layer and the exposed first passivation layer, the second passivation layer having an opening therein exposing a portion of the conductive layer. An electrical contact is bonded to the exposed portion of the conductive layer.