首页> 外国专利> COMPOSITE SEMICONDUCTOR DEVICE, LED PRINT HEAD THAT EMPLOYS THE COMPOSITE SEMICONDUCTOR DEVICE, AND IMAGE FORMING APPARATUS THAT EMPLOYS THE LED PRINT HEAD

COMPOSITE SEMICONDUCTOR DEVICE, LED PRINT HEAD THAT EMPLOYS THE COMPOSITE SEMICONDUCTOR DEVICE, AND IMAGE FORMING APPARATUS THAT EMPLOYS THE LED PRINT HEAD

机译:复合半导体器件,采用该复合半导体器件的LED印刷头以及采用该LED印刷头的图像形成装置

摘要

A composite semiconductor device includes a plurality of semiconductor thin films and a substrate on which the semiconductor thin films are attached. Each semiconductor thin film includes a plurality of semiconductor elements. Each semiconductor element includes a first contact region and a second contact region. The first contact region is connected to a first electrode, and the second contact region is connected to a second electrode. The semiconductor thin film is attached to a substrate such that the plurality of semiconductor elements are aligned in a row, and such that the first contact region and the second contact region are in the row of light emitting elements.
机译:复合半导体器件包括多个半导体薄膜和其上附着有半导体薄膜的基板。每个半导体薄膜包括多个半导体元件。每个半导体元件包括第一接触区域和第二接触区域。第一接触区域连接到第一电极,第二接触区域连接到第二电极。半导体薄膜附着在基板上,使得多个半导体元件排成一行,并且第一接触区域和第二接触区域位于发光元件的排中。

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