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COMPOSITE SEMICONDUCTOR DEVICE, LED PRINT HEAD THAT EMPLOYS THE COMPOSITE SEMICONDUCTOR DEVICE, AND IMAGE FORMING APPARATUS THAT EMPLOYS THE LED PRINT HEAD
COMPOSITE SEMICONDUCTOR DEVICE, LED PRINT HEAD THAT EMPLOYS THE COMPOSITE SEMICONDUCTOR DEVICE, AND IMAGE FORMING APPARATUS THAT EMPLOYS THE LED PRINT HEAD
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机译:复合半导体器件,采用该复合半导体器件的LED印刷头以及采用该LED印刷头的图像形成装置
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摘要
A composite semiconductor device includes a plurality of semiconductor thin films and a substrate on which the semiconductor thin films are attached. Each semiconductor thin film includes a plurality of semiconductor elements. Each semiconductor element includes a first contact region and a second contact region. The first contact region is connected to a first electrode, and the second contact region is connected to a second electrode. The semiconductor thin film is attached to a substrate such that the plurality of semiconductor elements are aligned in a row, and such that the first contact region and the second contact region are in the row of light emitting elements.
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