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THERMOSETTING RESIN COMPOSITION, RESIN FILM, METALLIC FOIL PROVIDED WITH AN INSULATION MATERIAL, INSULATION FILM PROVIDED WITH A METALLIC FOIL ON EACH SIDE, METAL-CLAD LAMINATE, MULTI-LAYERED METAL-CLAD LAMINATE, AND MULTI-LAYERED PRINTED WIRING BOARD
THERMOSETTING RESIN COMPOSITION, RESIN FILM, METALLIC FOIL PROVIDED WITH AN INSULATION MATERIAL, INSULATION FILM PROVIDED WITH A METALLIC FOIL ON EACH SIDE, METAL-CLAD LAMINATE, MULTI-LAYERED METAL-CLAD LAMINATE, AND MULTI-LAYERED PRINTED WIRING BOARD
A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I): R′m(H)kSiX4−(m+k) (I) (wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or —OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R′ is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); “k” is 1 or 2; “m” is 0 or 1; and “m+k” is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.
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机译:一种有机硅聚合物的制备方法,包括使含有35〜100摩尔%的通式(I)表示的硅烷化合物的硅烷化合物混合物进行水解和缩聚反应的步骤:<?in-line-formulae description =“在线公式” end =“ lead”?> R′ m Sub>(H) k Sub> SiX 4-( m + k) Sub>(I)<?in-line-formulae description =“ In-line Formulae” end =“ tail”?>(其中X是可水解和可缩合的基团,例如卤素原子(例如氯或溴)或-OR; R是1-4个碳原子的烷基或1-4个碳原子的烷基羰基; R ′是非反应性基团,例如1-4个碳原子的烷基或芳基(例如苯基);“ k”是1或2;“ m”是0或1;以及“ m + k”为1或2),进一步使所得产物与氢化硅烷化剂进行氢化硅烷化反应。
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