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Compliant probes and test methodology for fine pitch wafer level devices and interconnects
Compliant probes and test methodology for fine pitch wafer level devices and interconnects
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机译:适用于小间距晶圆级设备和互连的兼容探针和测试方法
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摘要
A compliant interposer sheet probe card and a method for testing a wafer or a wafer level package using the probe card are described. Test electronic circuits are connected on one side of a multi-layer substrate. A top side of a compliant interposer sheet is connected to an opposite side of the multi-layer substrate. A wafer or a wafer level package to be tested is contacted with pins on a bottom side of the compliant interposer sheet whereby the wafer or wafer level package can be tested.
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