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Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
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机译:线环,具有该线环的半导体器件,线键合方法和线键合装置
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摘要
A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top of a ball bonded to the first bonding point with a capillary. The wire loop is formed by a wire bonding method which includes: bonding the wire to the first bonding point; moving the capillary horizontally and vertically while carrying out loop control; bonding the wire to the vicinity of the top of the ball bonded to the first bonding point; and thereafter, moving the capillary horizontally and vertically to the second bonding point while delivering the wire and carrying out loop control, and then bonding the wire to the second bonding point.
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