Semiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method

摘要

A semiconductor device (10) with a wire loop comprises a wire (3) connecting a first bonding point (A) and a second bonding point (Z) therethrough, wherein the wire (3) has a crushed part (3c) formed therein by crushing the part of the wire (3) and a top of a ball (30) bonded to the first bonding point (A) with a capillary. The wire loop is formed by a wire bonding method which includes: bonding the wire (3) to the first bonding point (A) ; moving the capillary (4) horizontally and vertically while carrying out loop control; bonding by crushing a part of the wire (3) and the top of said ball (30) with the capillary to form a crushed part (3c) in the wire (3) to the vicinity of the top of the ball (30) bonded to the first bonding point (A); and thereafter, moving the capillary (4) horizontally and vertically to the second bonding point (Z) while delivering the wire (3) and carrying out loop control, and then bonding the wire (3) to the second bonding point (Z).