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Oxygen-doped Al-containing current blocking layers in active semiconductor devices in photonic integrated circuits (PICs)

机译:光子集成电路(PIC)中有源半导体器件中的含氧含Al电流阻挡层

摘要

In photonic integrated circuits (PICs) having at least one active semiconductor device, such as, a buried heterostructure semiconductor laser, LED, modulator, photodiode, heterojunction bipolar transistor, field effect transistor or other active device, a plurality of semiconductor layers are formed on a substrate with one of the layers being an active region. A current channel is formed through this active region defined by current blocking layers formed on adjacent sides of a designated active region channel where the blocking layers substantially confine the current through the channel. The blocking layers are characterized by being an aluminum-containing Group III-V compound, i.e., an Al-III-V layer, intentionally doped with oxygen from an oxide source. Also, wet oxide process or a deposited oxide source may be used to laterally form a native oxide of the Al-III-V layer. An example of a material system for this invention useful at optical telecommunication wavelengths is InGaAsP/InP where the Al-III-V layer comprises InAlAs:O or InAlAs:O:Fe. Other materials for the blocking layers may be InAlGaAs or alternating layers or alternating monolayers of AlAs/InAs. Thus, the O-doped blocking layers may be undoped, impurity doped or co-doped with Fe.
机译:在具有至少一个有源半导体器件(例如,埋入式异质结构半导体激光器,LED,调制器,光电二极管,异质结双极晶体管,场效应晶体管或其他有源器件)的光子集成电路(PIC)中,在其上形成多个半导体层衬底,其中这些层之一是有源区。电流通道形成通过该有源区域,该电流区域由在指定的有源区域通道的相邻侧面上形成的电流阻挡层限定,其中阻挡层基本上限制了通过沟道的电流。阻挡层的特征在于是含铝的III-V族化合物,即Al-III-V层,故意掺杂有来自氧化物源的氧。而且,可以使用湿式氧化物工艺或沉积的氧化物源来横向形成Al-III-V层的天然氧化物。在光通信波长下可用于本发明的材料系统的一个例子是InGaAsP / InP,其中Al-III-V层包括InAlAs:O或InAlAs:O:Fe。用于阻挡层的其他材料可以是InAlGaAs或AlAs / InAs的交替层或交替单层。因此,O掺杂的阻挡层可以是未掺杂的,杂质掺杂的或与Fe共掺杂的。

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