METHOD FOR MANUFACTURING PCB IMBEDDED CAPACITOR USING ATOMIC LAYER DEPOSITION PROCESS, AND CAPACITOR THUS OBTAINED

摘要

A method for manufacturing a PCB(Printed Circuit Board) embedded capacitor using an atomic layer deposition process and the capacitor are provided to minimize damages to a dielectric film by successively forming Ru seed layers on an Al2O3 film using the ALD(Atomic Layer Deposition) process. A lower electrode is mounted inside a reaction chamber. An Al metal precursor is introduced inside the reaction chamber, such that the Al metal precursor is attached to the lower electrode. Oxide gas is supplied to oxidize the Al metal to form an Al2O3 dielectric film. An Ru source is supplied into the reaction chamber, such that an Ru metal seed layer is formed on the dielectric film. An upper electrode is formed on the Ru seed layer. The Al metal precursor is a TMA(Thin Film Micromirror).