AIRTIGHT PACKAGE, PIEZOELECTRIC DEVICE, AND PIEZOELECTRIC OSCILLATOR

摘要

The invention may be joined to the insulating base by the lid to easy position adjustment prevent the deterioration of bonding strength due to the decrease in the contact area due to the shift of the lid, and even applied the thermal variation and impact peel off the bonding of the lid as to provide support hermetically sealed package, the piezoelectric device, the piezoelectric oscillator that is, hermetically sealed package 100 of the present invention, the insulating base 10, a lid body for sealing the opening 17 of the insulating base 10 (lid) ( 11) it consists of a bonding material 18 for bonding the insulating base 10 and the lid 11. The inside with respect to the insulating base 10 and the lid 11, the lid outer edge (11a, 11b, 11c, 11d) of 11, the outer peripheral surface of the insulating base 10 (10a, 10b, 10c, 10d) to, and is joined to it takes for each part of the concave portion is exposed to the upper surface 12 of the insulating base (10) (13a, 13b, 15a, 15b) state.