DEPOSITION OF SUPER HARD TiAlSiN THIN FILMS BY CATHODIC ARC PLASMA DEPOSITION

摘要

This invention relates to ultra-high hardness TiAlSiN film deposition method using a cathodic arc deposition, and a Ti target, AlSi target install the arc source, or prepared by the cutting tool of the ultra-high hardness by installing the Arc source, the target organic compound TiAlSi arc discharge while injecting nitrogen gas to form a plasma so as to form a coating layer on the target object surface TiAlSiN it is an object to provide an ultra-high hardness TiAlSiN film deposition method using a cathodic arc deposition. ; The present invention cathodic arc vapor deposition process for ultra-high-hardness thin film deposited using a cathodic arc deposition TiAlSiN largely Ti target and AlSi target, or the target installation process to install TiAlSi target; And the target to be processed is provided inside the vacuum chamber 10 ^-5 ~10 ^-7 Torr and the process of removing air inside the chamber down to; 10, the degree of vacuum within the chamber by injecting an inert gas into the chamber ^-1 ~10 ^-3 by setting a plasma Torr for cleaning an object to be treated in a surface cleaning process ; After introducing nitrogen into the chamber and electric current was applied to the arc source to form a plasma by applying a bias voltage is characterized by comprising forming a TiAlSiN layers. ; When applying the present invention, Ti The coating is applied to the target potential is 18V, and the coating current is 45A, AlSi 19V potential is applied to a coating target, the coating current is a result of the cathodic arc deposition to ensure that the 35A, the advantage that the obtained coating film of the ultra-high hardness all you have.