Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures

摘要

Preparation of wire bond pads right light emitting device having a current blocking mechanism and under the light emitting device are provided. The current cut-off mechanism may be a conductive area decreases in the active region of the device. The current cut-off mechanism can be a damage area in which a contact is formed thereon. The current cut-off mechanism may be a Schottky contact between the ohmic contact and the active region of the device. A semiconductor junction such as a PN junction may also be provided between the ohmic contact and the active region. ; Wire bond pads and active regions, the conductive regions, damage area, the schottky contact