Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structures

摘要

wire bond pads directly below the current cut-off mechanism in the light-emitting device having light emitting elements and a method of manufacture are provided the . The current cut-off mechanism may be a conductive region that is reduced in the active region of the device . The current cut-off mechanism may be the damage area where the contacts formed thereon. The current cut-off mechanism may be a Schottky contact between the ohmic contact and the active region of the device . A semiconductor junction such as a PN junction can also be provided between the ohmic contact and the active region .