首页> 外国专利> Method of forming silicide film having excellent thermal stability, semiconductor device and semiconductor memory device comprising silicide film formed by the same, and methods of manufacturing the same

Method of forming silicide film having excellent thermal stability, semiconductor device and semiconductor memory device comprising silicide film formed by the same, and methods of manufacturing the same

机译:形成具有优异热稳定性的硅化物膜的方法,包括该硅化物膜的半导体器件和半导体存储器件及其制造方法

摘要

The excellent thermal stability silicide film forming method, has been disclosed about the method of manufacturing a silicide film is formed in this way provided a semiconductor device as a semiconductor memory device, and these devices. The disclosed invention is a semiconductor element having a laminated structure sequentially film germanium film and the nickel on a silicon containing substrate, the heat-treating the resultant service nickel monosilicide film forming method containing germanium, and the thus formed nickel monosilicide film It provides a method of producing a semiconductor memory device, and these devices.
机译:关于以这种方式形成硅化物膜的方法,已经公开了优异的热稳定性硅化物膜形成方法,其提供了作为半导体存储器件的半导体器件以及这些器件。公开的发明是一种具有层叠结构的半导体元件,该半导体元件在含硅基板上依次成膜锗膜和镍,并对所得的含锗的服务化镍单硅化物膜形成方法进行热处理,以及由此形成的半导体单晶硅膜。半导体存储器件的制造以及这些器件。

著录项

  • 公开/公告号KR100738066B1

    专利类型

  • 公开/公告日2007-07-12

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20030086509

  • 发明设计人 박윤창;최철종;

    申请日2003-12-01

  • 分类号H01L21/24;

  • 国家 KR

  • 入库时间 2022-08-21 20:31:48

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