首页>
外国专利>
Manufacturing method of a crack-resistant semiconductor device and manufacturing apparatus therefor
Manufacturing method of a crack-resistant semiconductor device and manufacturing apparatus therefor
展开▼
机译:抗裂半导体器件的制造方法及其制造设备
展开▼
页面导航
摘要
著录项
相似文献
摘要
A crack-resistant fabrication method and fabrication apparatus for a semiconductor package prevents interface isolation and cracks by coating a semiconductor chip disposed in a semiconductor package, a paddle of a lead frame, bonding wires and a bond paste using a polyimide type coating material. The coating material forms a coating film to act as a buffering member. The fabrication method can include the steps of attaching a semiconductor chip on a paddle, electrically coupling the semiconductor chip and leads, forming a coating film on the surfaces of the semiconductor chip and the leads, and molding the semiconductor chip, the leads, and the coating film.
展开▼