Bipolar carrier wafers and mobile, bipolar, electrostatic wafer arrangement

摘要

The present invention relates to a bipolar carrier wafers and a mobile, bipolar electrostatic wafer arrangement. Such carrier wafers and the wafer arrangements, in particular in the region of the technology for handling of semiconductor wafers are used. The carrier wafer according to the invention serves to mount a disk-shaped semiconductor device. It has a first surface (2a) as the front and one of the first surface (2a) is positioned opposite the second surface (2b) as a rear side on. The carrier wafer is designed such that it comprises a carrier layer (2), a surrounding the carrier layer of electrically insulating coating layer (3) and an electrically conductive layer (4), wherein the latter on the electrically insulating coating layer is disposed and in at least two electrically separate areas is structured as electrodes. On the rear side (2b) of the carrier wafer are arranged electrical contacts, wherein these electrical contacts with the two on the front side (2a) are connected electrodes arranged. On the electrically conductive layer (4) is also an electrically insulating coating layer (8) is arranged, which both the front side (2a) as well as the edge of the carrier wafer between the front side (2a) and the rear side (2b) covers.