The method of improving a solder connection strength of a very small enamelled wire in the case of the sw

摘要

A method for improving the reliability of the welding spot between thin enameled wires and an electronic board and thus securing the connection therebetween, by pulling the terminals of the enameled wires to the back of the electronic board and thereby creating a bearing point on the structure of the board. The bearing point, positioned between the welding spot and the wire terminal, effectively prevents the external forces of stress from directly acting on the welding spot when the terminals of the wire are pulled, swung up and sown, or subjected to other external pulling forces.