PROBLEM TO BE SOLVED: To provide a vapor deposition film-forming apparatus and a vapor deposition film-forming method capable of uniformizing the distribution of vapor-deposited film thickness in the line direction of the vapor deposition source irrespective of the progress state of film formation, in the vapor deposition film-forming process using a line-type vapor deposition source.;SOLUTION: The vapor deposition film-forming apparatus includes a linear shaped crucible 12 to be filled with a vapor deposition material, a heat source 14 for heating the crucible 12, and a vapor deposition source 10 provided with a top surface plate 13a having a plurality of openings 11 arranged above the crucible 12 and linearly along the top surface plate 13a. A vapor deposition film is formed on a substrate such that the substrate to be a film-forming object is arranged opposedly to and above the vapor deposition source 10 and moved in a direction crossing at a right angle to the linearly extended direction of the vapor deposition source 10. The crucible 12 is partitioned by partition plates 12a so that a vapor deposition material m filled into the crucible 12 is uniformly consumed in the linearly extended direction when the vapor deposition material m is evaporated from the crucible 12 by being heated with the heat source 14.;COPYRIGHT: (C)2008,JPO&INPIT
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