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METHOD OF CLEANING SEMICONDUCTOR DEVICE MANUFACTURING COMPONENT, AND CLEANING SOLUTION COMPOSITION

机译:清洁半导体器件制造组件的方法以及清洁溶液的组成

摘要

PROBLEM TO BE SOLVED: To remove deposits on a component forming a semiconductor manufacturing apparatus without damaging quartz, ceramics and sapphire base material as base materials of the component.;SOLUTION: The semiconductor manufacturing apparatus component is cleaned, without damaging the base materials of the components, by using a cleaning composition containing at least one kind selected from among sodium fluoride, potassium fluoride, lithium fluoride and ammonium fluoride, and citric acid.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:在不损坏构成组件基础材料的石英,陶瓷和蓝宝石基材的情况下,去除形成半导体制造设备的组件上的沉积物;解决方案:清洁半导体制造设备组件,而不会损坏组件的基础材料。通过使用包含选自氟化钠,氟化钾,氟化锂,氟化铵和氟化铵中的至少一种和柠檬酸的清洁组合物制成成分; COPYRIGHT:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008153272A

    专利类型

  • 公开/公告日2008-07-03

    原文格式PDF

  • 申请/专利权人 TOSOH CORP;

    申请/专利号JP20060336917

  • 申请日2006-12-14

  • 分类号H01L21/304;C11D7/10;C11D7/26;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:18

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