OPENING STRUCTURE OF METAL MASK FOR SOLDER PRINTING, AND SOLDER PRINTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide the opening structure of a metal mask for solder printing capable of enhancing solder release characteristics in an opening of the metal mask for solder printing, and also stabilizing the printing of solder with respect to lands.;SOLUTION: The metal mask 10 for solder printing has the openings for printing solder on the lands of a substrate. The opening 11 is constituted of two land openings 12a, 12b formed in a way that they correspond to the lands 21a, 21b and a communication opening 11 for allowing the land openings 12a, 12b to communicate with each other, thereby allowing the opening 11 to include the two lands 21a, 21b when the metal mask 10 is arranged on the substrate 20. The volume of the opening 11 is made to be the total volume of solder printed on the lands 21a, 21b included by the opening 11. The area of each land opening 12a, 12b is made to be smaller by 10-20% than that of each land 21a, 21b.;COPYRIGHT: (C)2009,JPO&INPIT