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LASER ANNEALING TECHNIQUE, SEMICONDUCTOR FILM, SEMICONDUCTOR DEVICE, AND ELECTROOPTICAL DEVICE

机译:激光退火技术,半导体膜,半导体器件和光电器件

摘要

PROBLEM TO BE SOLVED: To provide a laser annealing technique that can highly crystallize the entire surface of an amorphous semiconductor film, hardly has granular crystal sections on nearly the entire surface of the amorphous semiconductor film, and can form a lateral crystal film without any joints, to provide a semiconductor film that has high crystallinity and is ideal as an active layer, or the like of a thin-film transistor (TFT) by using the technique, and to provide a semiconductor device, such as the TFT using the semiconductor film, and an electrooptical device.;SOLUTION: Laser annealing is executed under conditions where a granular crystal part and an amorphous part are melted and a lateral crystal part is not melted. Further, laser annealing is executed by changing laser beam irradiation conditions in the granular crystal part from those in the amorphous part so that |EA-EP||EA-EPs|... (1) is met, where EA is absorption light energy per unit area of laser beams at the amorphous part, EPs is absorption light energy per unit area of laser beams at the granular crystal part when laser beams are applied under the same laser beam irradiation conditions as those for the amorphous part, and EP is actual absorption light energy per unit area of laser beams at the granular crystal part.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:为了提供一种能够使非晶半导体膜的整个表面高度结晶的激光退火技术,几乎在非晶半导体膜的整个表面上几乎没有粒状晶体部分,并且可以形成没有任何接头的横向晶体膜。通过使用该技术,以提供具有高结晶度并且理想地用作薄膜晶体管(TFT)的有源层等的半导体膜,并提供半导体器件,例如使用该半导体膜的TFT解决方案:激光退火是在粒状晶体部分和非晶态部分熔化而侧面晶体部分不熔化的条件下执行的。此外,通过使粒状晶体部分中的激光束照射条件与无定形部分中的激光束照射条件改变,使得满足| EA-EP | <| EA-EPs | ...(1)来执行激光退火,其中EA是吸收光非晶态部分的激光的每单位面积的能量,EPs是在与非晶态部分相同的激光束照射条件下施加激光束时,在粒状晶体部分的激光的每单位面积的吸收光能量,EP为颗粒晶体部分的每单位面积激光束的实际吸收光能。;版权所有:(C)2008,JPO&INPIT

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