The electric electronic parts which include the part being jointed with the connection method and said connection method of the plane surface bundle conductors, in the joint system null circuit substrate of the plane surface bundle conductors, and the plane surface bundle conductors which

摘要

PROBLEM TO BE SOLVED: To provide the connection method for surely connecting a minute planar multiple conductor.;SOLUTION: Plating layers (13, 14) of low melting point metal are respectively adhered to the surfaces of conductors (12, 22) of flexible planar multiple conductor (10) and rigid planar multiple conductor (20). The concave and convex portions are formed depending on the mold to the flexible planar multiple conductor along the axial line thereof. In the overlapping region of the flexible planar multiple conductor, a bonding agent is adhered to form a bonding agent layer (15). Under the normal temperature, both multiple conductors are aligned with the conductors thereof provided opposed with each other and these are heated for a very short period using an iron or the like to attain temporary bonding. These are then finally bonded with pressure using a bonder under the higher pressure and temperature. Consequently, the fused low melting point metal bridge-couples the corresponding conductors, and the periphery thereof is bonded through thermosetting of the bonding agent.;COPYRIGHT: (C)2004,JPO&NCIPI