Circuit substrate for electronic module e.g. mechatronic module of motor vehicle, has connecting element that is arranged on outer surface, for forming electrical connection between contact surfaces of respective conductor layers

摘要

The circuit substrate comprises two stacked circuit boards (100) that are in contact with each other electrically, such that main extension direction of a conductor layer (110) of one circuit board is parallel to a main extension direction of the conductor layer of another circuit board. The contact surfaces (140) of strip conductors (130) of conductor layers are arranged on an outer surface (120) of the circuit boards. A connecting element is arranged on outer surface, for forming electrical connection between contact surfaces. Independent claims are included for the following: (1) method for manufacturing circuit substrate; and (2) electronic vehicle module.