Method for manufacturing e.g. n-type-solar cell in solar module that is utilized for generation of electrical power, involves arranging contact fingers on surface of substrate, and connecting fingers with surface of substrate to form alloy

摘要

The method involves arranging a set of contact fingers on or over a surface of a silicon substrate (102) i.e. wafer, where the contact fingers are made of III group metals e.g. aluminum and aluminum compound, in a periodic table and arranged in a light incidence front region (104) and a rear region (106) of a solar cell. The contact fingers are partial physically connected with the surface of the substrate by heating the substrate up to a temperature of 250-400 degree Celsius to form an alloy that comprises eutectic composition. The substrate is doped with n-type dopants or p-type dopants. An independent claim is also included for a solar cell.