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Electrical characteristics of n-GaN Schottky contacts on cleaved surfaces of free-standing substrates - Metal workfunction dependence of Schottky barrier height

机译:肖特基势垒高度依赖性基板裂解表面N-GaN肖特基触点的电气特性 - 金属工作障碍依赖性

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We report electrical characteristics of Schottky contacts with 9 different metals (Ag, Ti, Cr, W, Mo, Au, Pd, Ni, Pt) formed on clean m-plane surfaces by cleaving free-standing GaN substrates, comparing with the contacts on Ga-polar c-plane n-GaN surfaces grown on GaN substrates. The n-values in the forward current-voltage (I-V) characteristics are as good as 1.02 to 1.05 for the m-plane and 1.02 to 1.09 for the c-plane samples. We found that the reverse I-V curves of the both samples can be explained with the thermionic field emission theory, and the m-plane contacts have a metal work-function dependence of Schottky barrier heights as large as that of the Ga-polar c-plane n-GaN contacts. These results tell us that the cleaving method can provide the clean m-plane surfaces where Fermi-level pinning is as small as those of the c-plane.
机译:我们通过切割独立的GaN基板在清洁的M平面表面上报告肖特基触点的电气特性(Ag,Ti,Cr,W,Mo,Au,Pd,Ni,Pt),与触点相比 GaN基板上生长的Ga-Polar C面N-GaN表面。 正向电流 - 电压(I-V)特性的N值与C平面样本的M平面和1.02至1.09的1.02至1.05一样好。 我们发现,两个样品的反向IV曲线可以用热电偶发射理论解释,并且M平面触点具有肖特基势垒高度的金属工作函数依赖性,与GA极性C平面一样大。 n-gan触点。 这些结果告诉我们,切割方法可以提供清洁的M平面表面,其中费米级钉扎与C平面一样小。

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