首页> 外国专利> Reference value setting method, pattern determination method, alignment inspection equipment, semiconductor device manufacturing system, a method of manufacturing a semiconductor manufacturing plant and semiconductor device

Reference value setting method, pattern determination method, alignment inspection equipment, semiconductor device manufacturing system, a method of manufacturing a semiconductor manufacturing plant and semiconductor device

机译:参考值设定方法,图案确定方法,对准检查设备,半导体器件制造系统,半导体制造工厂的制造方法和半导体器件

摘要

PPROBLEM TO BE SOLVED: To provide a reference value setting method and a pattern determining method, wherein even in the case of an underlying pattern having a substantially circular shaped part, it is possible to determine the pertinence of the position of a resist pattern for the underlying pattern accurately. PSOLUTION: A metal wiring image is obtained as corresponding to a metal wiring having the substantially circular shaped part. After a real circle 108 is obtained in a shape approximate to the substantially circular shaped part 101a of the metal wiring image, a shortest straight distance 107 is obtained on an image between an ideal contact pattern image 106 corresponding to a contact pattern in designing of a resist to be formed corresponding to the metal wiring and the real circle 108. By use of this shortest straight distance 107, a reference value is decided for determining the pertinence of the position of a contact pattern corresponding to the metal wiring. PCOPYRIGHT: (C)2006,JPO&NCIPI
机译:

要解决的问题:提供参考值设置方法和图案确定方法,其中即使在基础图案具有基本圆形的部分的情况下,也可以确定抗蚀剂位置的相关性底层模式的精确模式。

解决方案:获得与具有大致圆形形状的部分的金属布线相对应的金属布线图像。在获得近似于金属布线图像的大致圆形部分101a的形状的实圆108之后,在对应于设计中的接触图案的理想接触图案图像106之间的图像上获得最短直线距离107。对应于金属布线和实圆108形成抗蚀剂。通过使用该最短直线距离107,确定用于确定与金属布线对应的接触图案的位置的相关性的参考值。

版权:(C)2006,JPO&NCIPI

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