The film condition adhesive for die bonding and production manner and semiconductor equipment of the semiconductor equipment which uses that

摘要

P To provide a die attach film capable of adhering an adhering agent for a die bonding and a film having a function of both a die attaching film and a dicing film to a wafer in a mild condition at not more than 60° C in a process for assembling a semiconductor. PSOLUTION: A peeling stength between a wafer and a film adhesive agent when the film adhesive agent is adhered to the back side of the wafer at 60° C is not less than 50g/25 mm. A resin composition comprises an acrylic acids copolymer with a glass transition temperature of not less than -30° C nor more than 60° C, and a film adhesive agent for die bonding including a epoxy resin and a die attaching film having the die dicing function can be manufactured by use of a light transparent base material for it. PCOPYRIGHT: (C)2005 and JPO& NCIPI