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Polishing method of square photomask substrates, square photomask substrates, photo-mask blanks and photomasks

机译:方形光掩模基板,方形光掩模基板,光掩模坯料和光掩模的抛光方法

摘要

PROBLEM TO BE SOLVED: To improve flatness of a substrate by applying the pressing load to an entire guide ring during grinding separately from the substrate to be ground, and to consistently provide flat substrates. ;SOLUTION: In this square substrate grinding method for grinding the square substrate having the square shape of the substrate to be ground, a surface to be ground of the substrate held in the guide ring of a substrate holding head having the guide ring is pressed against a grinding cloth, the guide ring is pressed against the grinding cloth, the grinding cloth, the substrate holding head and the substrate are rotated respectively, and the surface to be ground of the substrate is ground while pressing the grinding cloth by a grind head pressing surface of the guide ring.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:在研磨过程中,通过将压紧负荷施加到整个导环上,与待研磨的基材分开,以提高基材的平坦度,并始终提供平坦的基材。 ;解决方案:在这种用于研磨具有待研磨基板的正方形形状的正方形基板的正方形基板研磨方法中,将保​​持在具有导向环的基板保持头的导向环中的基板的待研磨表面压在其上。研磨布,将导向环压在研磨布上,使研磨布,基板保持头和基板分别旋转,并且在通过研磨头压紧研磨布的同时研磨基板的被研磨表面。导环表面。;版权:(C)2003,JPO

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