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Method for manufacturing a light-emitting body in the circuit board, the light emitting body in the circuit board precursor and the light emitting body in the circuit board, and the light emitter
Method for manufacturing a light-emitting body in the circuit board, the light emitting body in the circuit board precursor and the light emitting body in the circuit board, and the light emitter
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机译:用于制造电路板中的发光体,电路板前体中的发光体和电路板中的发光体的方法以及发光器
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摘要
Forming recesses having a bottom surface including a portion of the light emitting element is mounted are possible, object of the present invention, a light emitter emitting body in the circuit board precursor that can achieve weight reduction, also thin-walled and, and concave portions are formed a method of manufacturing a circuit board iodide, is to provide a light emitter as well be a substrate in which the recesses were formed. The liquid crystal polymer film surface, has at least one pair of electrode portions to be the light emitting device, method of manufacturing the light emitting body in the circuit board according to the present invention, other substrates in each of the electrode portions to be through the conductive circuit forming a metal circuit pattern is connected to the circuit, the part including the electrode portions to be, and the bottom the electrode portions to be and should be present is the conductive circuit, and the wall surface the conductive circuit should exist and characterized in that it comprises forming a recess having.
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