Method of manufacturing a light-emitting -body circuit board , the light-emitting -body circuit board precursor and the light-emitting -body circuit board , and light emitters .

摘要

Forming recesses having a bottom surface including a portion of the light emitting element is mounted are possible, object of the present invention, a light emitter emitting body in the circuit board precursor that can achieve weight reduction, also thin-walled and, and concave portions are formed a method of manufacturing a circuit board iodide, is to provide a light emitter as well be a substrate in which the recesses were formed. The liquid crystal polymer film surface, has at least one pair of electrode portions to be the light emitting device, method of manufacturing the light emitting body in the circuit board according to the present invention, other substrates in each of the electrode portions to be through the conductive circuit forming a metal circuit pattern is connected to the circuit, the part including the electrode portions to be, and the bottom the electrode portions to be and should be present is the conductive circuit, and the wall surface the conductive circuit should exist and characterized in that it comprises forming a recess having.