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Semiconductor Devices Having Contact Holes Including Protrusions Exposing Contact Pads and Methods of Fabricating the Same
Semiconductor Devices Having Contact Holes Including Protrusions Exposing Contact Pads and Methods of Fabricating the Same
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机译:具有包括暴露接触垫的凸起的接触孔的半导体器件及其制造方法
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摘要
Semiconductor devices are provided including a semiconductor substrate and a first interlayer insulating layer on the semiconductor substrate. A contact pad is provided in the first interlayer insulating layer and a second insulating layer is provided on the first interlayer insulating layer. A contact hole is provided in the second interlayer insulating layer. The contact hole exposes the contact pad and a lower portion of the contact hole has a protrusion exposing the contact pad. The protrusion is provided on the second interlayer insulating layer. A contact spacer is provided on inside sidewalls of the contact hole and fills the protrusion. A contact plug is provided in the contact hole. Related methods are also provided herein.
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