Vertical Integration of Passive Component in Semiconductor Device Package for High Electrical Performance

摘要

A high performance package and methods for its assembly are disclosed. A semiconductor package system of the invention is assembled in a method including the steps of affixing one or more spacers to a package substrate and affixing one or more passive components to the substrate adjacent to the spacers in order to define a plane. A semiconductor chip is affixed in the plane atop the one or more passive components and spacers and is electrically coupled to the one or more passive components.