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Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
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机译:将引线键合集成电路管芯堆叠在倒装芯片键合集成电路管芯上的方法
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摘要
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area on the surface of the base at least partially bounded by the wire-bondable pads. A first integrated circuit (IC) die is flip-chip bonded to the flip-chip pads, and a second IC die is back-side attached to the first IC die and then wire-bonded to the wire-bondable pads. As a result, the flip-chip mounted first IC die is stacked with the second IC die in a simple, novel manner.
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