METHODS FOR CHARACTERIZING DEFECTS ON SILICON SURFACES, ETCHING COMPOSITION FOR SILICON SURFACES AND PROCESS OF TREATING SILICON SURFACES WITH THE ETCHING COMPOSITION

摘要

Methods for characterizing defects on silicon surfaces, etching composition for silicon surfaces and process of treating silicon surfaces with the etchingcomposition AbstractThe present invention relates to a method for characterizing defects on silicon surfaces, in particular silicon wafers, a method for treating silicon surfaces with an etching solution and the etching solution to be employed in the method and process of the present invention.Fig. 6