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Methods for characterizing defects on silicon surfaces, etching composition for silicon surfaces and process of treating silicon surfaces with the etching composition
Methods for characterizing defects on silicon surfaces, etching composition for silicon surfaces and process of treating silicon surfaces with the etching composition
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机译:表征硅表面上的缺陷的方法,用于硅表面的蚀刻组合物以及用该蚀刻组合物处理硅表面的方法
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摘要
The present invention relates to a method for characterizing defects on silicon surfaces, in particular silicon wafers, a method for treating silicon surfaces with an etching solution and the etching solution to be employed in the method and process of the present invention.
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