A Cu-Zn copper alloy which is for use in electronic parts such as terminals and connectors and has high strength and excellent bendability. The Cu-Zn alloy having high strength and excellent bendability comprises 20-40 mass% Zn and, as the remainder, Cu and unavoidable impurities, and has such crystal grain characteristics that the average crystal grain diameter (mGS) is 1-4 µm and the standard deviation (σGS) of the crystal grain diameters is 1/3 mGS or less. In the alloy, the relationship {I(220)+I(111)}/I(200) between X-ray diffraction intensities in an examination of a rolled plane is 2.0-5.0. The Cu-Zn alloy may further contain any one or more of Ni, Si, Fe, Ti, Co, and Sn in an amount of 0.01-0.3 mass%. The alloy preferably has a sulfur content of 30 ppm or lower and has a surface roughness (Ra) of 0.2 µm or lower.
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