The aim of the invention is to disclose a camera module, the construction of which is achieved exclusively on wafer planes. Known methods for rewiring the contacts of a semiconductor wafer from the active face to the back face are used and the lenses and shutter structures produced on a wafer scale are provided on the rewired semiconductor wafer which has the light-sensitive elements. The separation of the wafer composite comprising the rewired semiconductor wafer, the shutter and lens structures into individual camera modules is achieved by sawing, which can be achieved in multiple stages depending on the height of construction.
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