Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1) below, (B) a curing agent, (C) an inorganic filler, and (D) a cyanate resin and/or a prepolymer thereof. [chemical formula 1] (1) (In the formula, Ar represents a fused-ring aromatic hydrocarbon group; r represents an integer not less than 1; X represents a hydrogen or an epoxy group (a glycidyl ether group); R1 represents one group selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n represents an integer not less than 1; and p and q each represents an integer not less than 1, and p's and q's in respective repeating units may be the same as or different from one another.)
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