首页> 外国专利> A SELF-ALIGNED PATTERING METHOD BY USING NON-CONFORMAL FILM AND ETCH BACK FOR SONOS MEMORY

A SELF-ALIGNED PATTERING METHOD BY USING NON-CONFORMAL FILM AND ETCH BACK FOR SONOS MEMORY

机译:基于非共形膜和回切的SONOS记忆自对准贴图方法

摘要

A method for fabricating a memory device with a self-aligned trap layer (1301, 1308) which is optimized for scaling is disclosed. In the present invention, a non-conformal film (1406, 1407) is deposited over the charge trapping layer (1104) to form a thick film on top of the core source/drain region (1302) and a pinch off (1111) and a void (1107) or a narrow channel (1112) at the top of the STI trench (1103). An etch is performed on the non-conformal film (1406, 1407) to open pinch-off (1111) or widen the narrow channel (1112) in the non-conformal (1406, 1407). The trapping layer (1104) is then completely or partially etched between the core cells. The non-conformal film (1406, 1407) is removed. And a top oxide is formed. The top oxide converts the remaining trap layer (1104) to oxide if the trapping layer (1104) is partially etched and thus isolate the trap layer.
机译:公开了一种用于制造具有针对对准而优化的自对准陷阱层(1301、1308)的存储器件的方法。在本发明中,在电荷俘获层(1104)上沉积非共形膜(1406、1407),以在芯源/漏区(1302)的顶部上形成厚膜,并夹断(1111)和在STI沟槽(1103)的顶部的空隙(1107)或狭窄的通道(1112)。对非保形膜(1406、1407)执行蚀刻以打开夹断(1111)或加宽非保形膜(1406、1407)中的窄通道(1112)。然后在核心单元之间完全或部分蚀刻捕获层(1104)。去除非保形膜(1406、1407)。并形成顶部氧化物。如果捕集层(1104)被部分蚀刻,则顶部氧化物将剩余的捕集层(1104)转化成氧化物,从而隔离了捕集层。

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