a flexible printed circuit board having flip chip bonding domain aligned top layer bump and inner layer trace

摘要

A flexible printed circuit board having a flip chip bonding region on which a top layer bump and an inner layer trace is provided to optimize a space use by forming the inner layer trace wider than a width of the top layer bump. A flexible printed circuit board having a flip chip bonding region on which a top layer bump and an inner layer trace includes a flip chip bonding region(10), the top layer bump(13), and the inner layer trace(11). The top layer bump(13) and the inner layer trace(11) are formed to be overlapped on the flip chip bonding region. The width of the top layer bump(13) is formed wider than the width of the inner layer trace(11). The width of the inner layer trace(11) is wider as much as 5~20 % than the width of the top layer bump. The correlation of the width of the inner layer trace(11) and the width of the top layer bump(13) is adapted to the flexible printed circuit board having at least two layers.