Formation method of solder bumps using thin film heater fabricated on IC chip or IC chip wafer and the facility to make the same

摘要

The present invention relates to a method and apparatus for forming a solder bump on a semiconductor chip wafer before dicing the semiconductor chip or the semiconductor chip, and more particularly, to a semiconductor chip wafer before dicing the semiconductor chip or the semiconductor chip. The present invention relates to a method and apparatus for forming a solder bump by reflowing a solder of a semiconductor chip by applying a current to a thin film heater. In addition, the present invention uses a thin film heater formed on a semiconductor chip wafer before dicing the semiconductor chip or semiconductor chip in an inert gas atmosphere such as argon or nitrogen, a flux-free soldering gas such as hydrogen, or vacuum without using flux. The present invention relates to a method and apparatus for forming solder bumps in a flux-free process by reflowing solder in a semiconductor chip.;According to the present invention, by applying a current to a thin film heater formed on a semiconductor chip or a semiconductor chip wafer, the heat generated from the thin film heater is conducted to the solder of the semiconductor chip through a silicon (Si) semiconductor having excellent thermal conductivity and these solders are reflowed. Solder bumps are formed.;According to the present invention, by forming a solder bump using a thin film heater formed on a semiconductor chip or a semiconductor chip wafer, there is an advantage of simplifying the solder bump forming method and apparatus and improving thermal efficiency as compared with the conventional method. In addition, environmentally friendly advantages are achieved by forming solder bumps using a thin film heater formed on a semiconductor chip or a semiconductor chip wafer in an inert gas atmosphere such as argon or nitrogen, a flux-free soldering gas such as hydrogen, or a vacuum without using flux. There is an economical advantage to omit the flux cleaning process.;Thin Film Heater, Solder Bump, Semiconductor, Reflow, Flip Chip