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METHOD OF OBTAINING EPITAXIAL FILMS OF (SiC)1-x(AlN)x SOLUTIONS

机译:(SiC) 1-x (AlN) x 解决方案获得表观薄膜的方法

摘要

FIELD: chemistry.;SUBSTANCE: invention concerns technology of obtaining multicomponent semiconductor materials and can be applied in electronic industry for obtaining semiconductor material, solid (SiC)1-x(AlN)x solution, in manufacturing of solid power or optic electronic devices based on it, in obtaining cushion (SiC)1-x(AlN)x layers for aluminum nitride (AlN) or gallium nitride (GaN) crystal cultivation on silicon carbide (SiC) substrate. Epitaxial films of solid solution of silicon carbide and aluminum nitride (SiC)1-x(AlN)XJ where 0x1, are obtained by sedimentation of solid solution to monocrystallic SiC-6H substrate at 1000°C via ion plasma magnetron sputtering of solid polycrystallic (SiC)1-x(AlN)x solution target, where 0x1, the sputtering performed under effect of alternate current with frequency of 13.56 MHz.;EFFECT: obtaining high-quality monocrystallic films in the whole range of chemical composition transformation and improved efficiency of high-resistance target sputtering.;1 ex, 3 dwg
机译:技术领域:本发明涉及获得多组分半导体材料的技术,并且可以应用于电子工业中获得固态(SiC) 1-x (AlN) x 的半导体材料。 Sub>解决方案,在制造基于固体的功率或光电子设备中,获得用于氮化铝(AlN)的缓冲(SiC) 1-x (AlN) x 层)或在碳化硅(SiC)衬底上进行氮化镓(GaN)晶体培养。碳化硅和氮化铝(SiC) 1-x (AlN) XJ 的固溶外延膜是通过固溶沉积到固体多晶(SiC) 1-x (AlN) x 溶液靶的离子等离子体磁控溅射在1000℃下制备单晶SiC-6H衬底,其中0

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