首页> 外国专利> Electroplating apparatus for circuit boards has anode which consists of sheet metal and is mounted on adjusting screws, allowing its shape to be changed to provide desired current density between it and boards at different points

Electroplating apparatus for circuit boards has anode which consists of sheet metal and is mounted on adjusting screws, allowing its shape to be changed to provide desired current density between it and boards at different points

机译:用于电路板的电镀设备具有阳极,阳极由金属薄板组成,并安装在调节螺钉上,可以改变其形状,以在电路板和电路板之间的不同位置提供所需的电流密度

摘要

Electroplating apparatus for circuit boards (12) has a conveyor (18) whose rollers have a conductive coating, allowing it to act as cathode. The anode (20) consists of sheet metal and is mounted on adjusting screws (22). This allows its shape to be changed to provide the desired current density between it and the boards at different points. An independent claim is included for a method for operating an electroplating apparatus comprising altering the shape of the anode to provide different thicknesses of coating at different positions.
机译:用于电路板(12)的电镀设备具有输送机(18),其辊具有导电涂层,使其可以用作阴极。阳极(20)由金属薄板组成,并安装在调节螺钉(22)上。这样可以改变其形状,以在其与电路板不同点之间提供所需的电流密度。包括用于操作电镀设备的方法的独立权利要求,该方法包括改变阳极的形状以在不同位置提供不同厚度的涂层。

著录项

  • 公开/公告号DE102007015641A1

    专利类型

  • 公开/公告日2008-10-02

    原文格式PDF

  • 申请/专利权人 HOELLMUELLER MASCHINENBAU GMBH;

    申请/专利号DE20071015641

  • 发明设计人 KOSIKOWSKI THOMAS;

    申请日2007-03-31

  • 分类号C25D17/10;C25D21/12;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:20

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