Guidelines for Waste Reduction and Recycling: Metal Finishing, Electroplating, Printed Circuit Board Manufacturing

摘要

The guidance manual describes waste reduction techniques for metal finishing, metal fabricating, electroplating, and printed circuitboard manufacturing operations. Techniques which can be applied to a wide range of industrial processes and those which are process-specific are discussed. Evaporation, reverse osmosis, ion exchange, electrodialysis, ultrafiltration, and electrolytic recovery are described. The manual also describes waste reduction assessment procedures.