non polarized eingangsschutz to avoid short circuits

摘要

The method involves forming a protective covering over an entrance-guard portion (212) of an interconnect line (216). The covering is in electrical communication with a substrate. Another protective covering formed over an equipotential portion (208) of the interconnect line is electrically isolated from the substrate. A barrier layer is formed between the line and the substrate. Independent claims are also included for the following: (a) an interconnect shield for protecting an interconnect line disposed over a substrate to conduct electrical signals in a microelectromechanical system (b) a method for fabricating a microelectromechanical system (c) a microelectromechanical device.