A method for improving the heat stability of polyparaxylylene and a derivative film thereof to improve the heat resistance of the polyparaxylylene and the derivative film thereof without deteriorating deposition characteristics or profitability, and a polyparaxylylene derivative whose heat resistance is improved are provided. When the polyparaxylylene or the derivative film thereof represented by a below-described general formula 1 is formed by a chemical vapor deposition method, an amino-(2.2)-paracyclophane compound represented by a below-described general formula 3 is mixed in a (2.2)-paracyclophane compound represented by a below-described general formula 2 to form a film. (In the formula 1, X 1 and X 2 designate hydrogen, lower alkyl or halogen. X 1 and X 2 may be the same or different. n represents a degree of polymerization.) (In the formula 2, X 1 and X 2 have the same meanings as those of the formula 1.) (In the formula 3, X 3 designates hydrogen or a lower alkyl group. Y 1 and Y 2 designate hydrogen or an amino group and both Y 1 and Y 2 are not hydrogens at the same time.)
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