CONDUCTIVE ADHESIVE AND SEMICONDUCTOR DEVICE HAVING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive adhesive which has improved heat conductivity and is excellent in heat radiability.;SOLUTION: Provided is the conductive adhesive 30 containing a main agent comprising an epoxy resin, a curing agent comprising an amine-based resin, a diluent for mixing the main agent and the curing agent, and further 8-quinolinol, as a resin 33, containing a block or flake-like first filler 31 comprising Ag, and a block or flaky second filler 32 comprising Ag and having a less thickness and a larger specific surface area than those of the first filler 31, as a conductive filler, wherein the total content of the conductive fillers 31, 32 is 84 to 90 wt.%.;COPYRIGHT: (C)2009,JPO&INPIT